Electronegativity effects in chemical sputteringSACHER, E; CURRIE, J. F; YELON, A et al.Surface science. 1989, Vol 220, Num 1, pp L679-L686, issn 0039-6028Article

On the dual role of the Knudsen layer and unsteady, adiabatic expansion in pulse sputtering phenomenaKELLY, R.The Journal of chemical physics. 1990, Vol 92, Num 8, pp 5047-5056, issn 0021-9606Article

The effect of atomic-scale etch pit formation on depth resolution in sputter profilingCARTER, G; NOBES, M. J; KATARDJIEV, I. V et al.Surface and interface analysis. 1990, Vol 15, Num 7, pp 447-450, issn 0142-2421Article

Nonlinear feedback control of surface roughness using a stochastic PDE : Design and application to a sputtering processYIMING LOU; CHRISTOFIDES, Panagiotis D.Industrial & engineering chemistry research. 2006, Vol 45, Num 21, pp 7177-7189, issn 0888-5885, 13 p.Article

Some novel applications of sputtering technique for diffusion studies in solidsGUPTA, Devendra.Zeitschrift für Metallkunde. 2004, Vol 95, Num 10, pp 928-938, issn 0044-3093, 11 p.Article

Behaviour of xenon atoms on cold metal targets studied by ion reflection and ion-electron emission methodsSOSZKA, W; KWASNY, S; BUDZIOCH, J et al.Physics letters. A. 1989, Vol 138, Num 9, pp 531-535, issn 0375-9601, 5 p.Article

Deceleration ion optical system for sputtering measurements between 50 and 500 eV as function of angle of incidenceLIEBL, H; BOHDANSKY, J; ROTH, J et al.Review of scientific instruments. 1987, Vol 58, Num 10, pp 1830-1832, issn 0034-6748Article

Reduction of pumping time for a sputtering system by glow discharge cleaningKAGATSUME, A; UEDA, S; AKIBA, M et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1991, Vol 9, Num 4, pp 2364-2368, issn 0734-2101Article

Oxygen and CO Adsorption on Au/SiO₂ Catalysts Prepared by Magnetron Sputtering: The Role of Oxygen StorageXIAOLIN ZHENG; VEITH, Gabriel M; REDEKOP, Evgeniy et al.Industrial & engineering chemistry research. 2010, Vol 49, Num 21, pp 10428-10437, issn 0888-5885, 10 p.Conference Paper

An Alternative Solution for Sputtering Targets for High-Volume Thin-Film DepositionVILLAFUERTE, Julio; WRIGHT, David.Welding journal. 2010, Vol 89, Num 9, pp 28-30, issn 0043-2296, 3 p.Article

The use of magnetron sputtering for the production of heterogeneous catalystsVEITH, Gabriel M; LUPINI, Andrew R; PENNYCOOK, Stephen J et al.Studies in surface science and catalysis. 2006, pp 71-78, issn 0167-2991, isbn 0-444-52827-X, 1Vol, 8 p.Conference Paper

Electric probe measurements in pulsed magnetron plasmasBRADLEY, J. W; KARKARI, S; VETUSHKA, A et al.Surface engineering. 2004, Vol 20, Num 3, pp 186-188, issn 0267-0844, 3 p.Conference Paper

Contribution of back-scattered ions in sputtering of non-ordered materialsPLETNEV, V. V.Vacuum. 1993, Vol 44, Num 9, pp 935-936, issn 0042-207XConference Paper

O_n⁺ clusters produced by the sputtering of solid oxygenMAGNERA, T. F; MICHL, J.Zeitschrift für Physik. D, atoms, molecules and clusters. 1993, Vol 26, Num 1-4, pp 93-97, issn 0178-7683Conference Paper

Problems encountered in calculations of collisional mixing in compoundsKONOPLEV, V; JIMENEZ-RODRIGUEZ, J. J; GRAS-MARTI, A et al.Journal of physics. Condensed matter (Print). 1993, Vol 5, Num 33A, pp A303-A304, issn 0953-8984, SUPConference Paper

Statistical properties of sputtering from individual atomic collision cascades in solidsHOU, M; ECKSTEIN, W.Journal of applied physics. 1992, Vol 71, Num 8, pp 3975-3980, issn 0021-8979Article

Simple planar magnetron sputtering sourceRASTOGI, R. S; VANKAR, V. D; CHOPRA, K. L et al.Review of scientific instruments. 1987, Vol 58, Num 8, pp 1505-1506, issn 0034-6748Article

Teilchenbelastung der Substrate beim Magnetronzetstäuben = Particle loading of substrate by magnetron sputteringKUPFER, H; ACKERMANN, E; SCHAARSCHMIDT, G et al.Wissenschaftliche Zeitschrift der Technischen Universität Karl-Marx-Stadt/Chemnitz. 1991, Vol 33, Num 4, pp 465-470Article

Beam-size measurements in focused ion beam systemsHARRIOTT, L. R.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1990, Vol 8, Num 2, pp 899-901, issn 0734-2101Article

Deposition error compensation for optical multilayer coatings. II: Experimental results-sputtering systemSULLIVAN, B. T; DOBROWOLSKI, J. A.Applied optics. 1993, Vol 32, Num 13, pp 2351-2360, issn 0003-6935Article

Characterization of the fluxes of neutral and positively charged clusters (Ag_n and Ag_n⁺; n≤4) produced by argon ion sputtering of silverFRANZREB, K; WUCHER, A; OECHSNER, H et al.Zeitschrift für Physik. D, atoms, molecules and clusters. 1993, Vol 26, pp S101-S103, issn 0178-7683, SUPConference Paper

The impact of the metallization technology on junction behaviorPOLIGNANO, M. L; CIRCELLI, N.Journal of applied physics. 1990, Vol 68, Num 4, pp 1869-1877, issn 0021-8979Article

A new proton-conducting porous silicon membrane for small fuel cellsPICHONAT, T; GAUTHIER-MANUEL, B; HAUDEN, D et al.Chemical engineering journal (1996). 2004, Vol 101, Num 1-3, pp 107-111, issn 1385-8947, 5 p.Conference Paper

Analysis and characterization of In-film defects generated during sputter deposition of aluminum-alloy filmsABBURI, M; PAVATE, V; CHIANG, S et al.SPIE proceedings series. 1998, pp 132-137, isbn 0-8194-2714-4Conference Paper

Nonlinear Photon Stimulated Desorption from an oxidized tungsten surfaceTAYLOR, D. P; HELVAJIAN, H.SPIE proceedings series. 1998, pp 25-33, isbn 0-8194-2713-6Conference Paper